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InnoFour News | October
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Dear ,
Solna, Sweden? Eindhoven, the Netherlands? Münich, Germany? Our experts will be at various locations across Europe in the coming weeks to personally inform you, answer your questions, or share the latest developments and opportunities. If you can't make it, don’t worry, you can also register for one of our Feature Talks online, or if your question is more pressing, just give us a call. InnoFour. Always close by to help you.
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INTRODUCTION TO ELECTRICAL DESIGN OPTIMIZATION
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Efficient electrical system design is becoming increasingly critical across industries — from industrial machinery to aerospace and software-defined vehicles. Yet, traditional workflows often involve complex tasks, disconnected teams, and costly delays. Our new guide, The Electrical Design Playbook, highlights proven tactics and best practices to streamline your electrical design process and boost efficiency.
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| CHECK THIS |
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BOOST YOUR CRA COMPLIANCE CAPABILITIES WITH POLARION |
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Siemens has enhanced its Polarion platform to help development teams prepare for the EU Cyber Resilience Act, set for full enforcement in 2027. The update strengthens end-to-end compliance with features like integrated SBOM management, risk analysis, and continuous vulnerability tracking. With potential fines reaching €15 million or 2.5% of global turnover, early adoption is critical for software-driven manufacturers. |
| BOOST YOUR TEAM |
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BOM CONNECTOR FEATURE TALK
EXCLUSIVE ELECTRONICS CONTENT
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Missed the latest Feature Talk? Register here for the exclusive Electronics Content and get immediate access to the recordings of the previous BOM Connector Feature Talks. The registration process is - as known from other premium content offers - multi-stage for the first access. |
| REGISTER HERE |
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PCB AND SYSTEMS FORUM SWEDEN - THE NETHERLANDS |
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This year, the PCB Forum is presenting itself for the first time in an expanded format as the PCB and Systems Forum. We are thus creating a central platform for exchange and collaboration in systems design, specifically highlighting and promoting synergies between PCB and FPGA development. The focus is on innovative solutions for the holistic development of electronic systems: from model-based systems development and intelligent, AI-supported workflows to current challenges in security and verification. |
| REGISTER FOR PCB AND SYSTEMS FORUM SOLNA - SWEDEN HERE |
| REGISTER FOR PCB AND SYSTEMS FORUM EINDHOVEN - THE NETHERLANDS HERE |
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SEMI TRUNK ROUTING
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For one of our customers, we received a question about how to maintain plane flow with VIAs under a BGA when repositioning those VIAs. Especially with a fine VIA grid, it can take time to center the VIAs neatly between others. The challenge is that even the slightest movement of a VIA can cause the plane to be cut between two VIAs. From a design perspective, this is undesirable as it restricts plane flow.
So, is there a way to make the VIAs snap to the BGA grid, allowing them to be moved around under the BGA without cutting the plane? Absolutely. To demonstrate this, we’ve created a video showing how to align the VIA grid with the BGA grid anywhere on the board.
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| WATCH THE VIDEO |
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HOPE TO SEE YOU ON NOVEMBER 20TH |
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Join us at the exhibition and conference on challenges in complex software engineering, AI in high-tech, and systems architecture. The conference program will cover the following topics: |
| REGISTER HERE |
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Generative AI
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Software quality
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System architecture
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QUESTA ONE - CLOSE THE PRODUCTIVITY GAPS
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Questa One is Siemens EDA’s AI-powered verification platform, engineered to close productivity gaps in 3D-IC and chiplet designs. It accelerates verification via faster engines, automates workflows via AI, and lightens verification workloads to boost coverage and confidence. It enables faster engines, faster engineers, and fewer workloads to drive higher performance and productivity. |
| MORE INFO |
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Under the hood, it does more than just speed things up: it brings synergy across the verification stack. With over a dozen new products and 17+ generative, analytic, and prescriptive AI capabilities, it spans simulation & debug, formal, static, design creation, and verification IP. If your team is dealing with verification scaling pains in modular, multi-chip or 3D architectures, Questa One might be exactly what you need.
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HOPE TO SEE YOU IN MÜNCHEN, GERMANY
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Electronics manufacturing is undergoing change – a digital transformation that spans every stage of the value chain. Under the guiding theme “Innovative Power Electronics”, Productronica 2025 will showcase the potential of digital processes. Var Group will demonstrate how you can implement these digital processes and actively shape the future of power electronics.
Booth highlights: Experience a hands-on example of how ECAD-MCAD collaboration with a shared data backbone and seamless integration works in practice. Gain valuable industry insights in their keynote sessions and take the opportunity to engage in in-depth discussions with Var Group experts at the booth.
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| REGISTER TODAY |
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